KS400HR Sputter Systems

Kenosistec designed the Horizontal sputtering systems of the KS-HR family to enhance , improved film uniformity ,process versatility.

There features make them the ideal tools for R&D ACTIVITIES and process development. A full range of options is available to optimize their performances for special applications.

APPLICATIONSM

Thin film structures of metals, oxides for Aerospace, Microelectronics, Sensors, Automotive, Optics and Energy.

GENERAL FEATURE

Configuration

Sputter up or sputter down

Substrate handling

All the KS Horizontal models include automatic handling of the substrate holder. Substrate rotation to improve deposition uniformity. Load lock with optional parking device is included. Optional devices for substrate heating or cooling are available.

Co-sputtering

Sequential or Confocal capability Circular cathodes from 1” to 10”

Gas & Pressure

p to 5 independent MFC’s with individual shut off valve. Upstream and downstream pressure control.

Process Controller

The process and system controller is composed by a PLC and a PC. The process controller directly operates all system components under supervision of the system controller.

System is fully automatic and each chamber is independent and processes can be run simultaneously in all the chambers.

The system and process controller includes:

• Siemens PLC
• PC with hard disk, monitor TFT 17” with integrated keyboard and mouse
• The controller allows remote monitoring and remote servicing via modem in order to receive technical assistance in real time.
• Different level password system to give access only to authorized personnel.
• All the necessary safety interlocks are included.